Research
Work done at ASM (2021-2024):
- Develop conformal (structure aspect ratio > 1000:1), low resistivity, fluorine free, minimal stress metal ALD films for Vertical NAND flash memory applications.
- Develop low temperature selective metal ALD films for BEOL logic applications.
- Explore various process strategies and CIP hardware to enable the above at HVM.
Publicly available image of Synergis® ALD platform is shown on the right.
Work done at Applied Materials (2019-2021):
- Optimize existing Plasma-enhanced Atomic Layer Deposition (PEALD) processes by understanding key reaction mechanisms in the associated plasma chemistry.
- Develop new precursors and identify new ALD pathways that enable novel dielectric films for FEOL logic applications.
- Explore self-limiting activation/passivation processes for substrate selective ALD.
Publicly available patent diagrams on Olympia® system configurations are shown on the right.
